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Fanless Industrial Computers & Embedded Box PCs · ComputeOps™

A unified computing architecture for core industrial compute needs, made up of four series — standard / modular / AI computing / rackmount. Covering general control, edge inference and data-center deployment.

4 series Standard · Modular · AI · Rackmount
50+ models In production · long-term supply
-40~70°C Wide-temp operation · industrial reliability
157 TOPS Peak AI compute · Jetson Orin
Browse the Four Series Contact Us
  • Intel® Core™ 7-13 / Xeon®
  • NVIDIA® Jetson Orin / Nano
  • AMD Ryzen™ / EPYC™
  • Domestic · Phytium / Rockchip / Loongson
FlexCore modular box PC fanless embedded computer FlexCore™ Modular
Jetson edge AI Jetson Edge AI
fanless industrial PC Fanless Industrial PC
rackmount industrial PC 1U / 2U / 4U Rackmount
PLATFORM PILLARS

Four Capability Pillars for Full-scenario Industrial Computing

Through standardized design and modular reuse, we build a scalable, collaborative, field-ready industrial computing foundation.

Compute Performance

Full coverage of Intel® Core™ 7th–13th Gen, Xeon® workstation-class, NVIDIA Jetson, AMD Ryzen™ and ARM domestic platforms.

I/O Expansion

PCIe / M.2 / MXM / i-Connect modular expansion; any combination of multi-COM, isolated DIO, CAN and PoE.

Modular Reuse

FlexCore™ three-board architecture: i-Core + i-Function + i-Connect — reuse to cut cost and boost efficiency.

Industrial-grade Stability

Wide temperature -40 to +70°C, 9-36V wide-range input, 5Grms vibration resistance; MTBF ≥ 60,000 hours for 7×24 field operation.

DEFINITION · WHAT IS COMPUTEOPS

What Is ComputeOps™?

An Industrial Computing Platform is high-reliability computing hardware designed for 7×24 continuous operation in the field. Unlike consumer or commercial PCs, an industrial computing platform must meet three core characteristics at once:

01

Industrial-grade Reliability

Fanless cooling + MTBF 60,000h+ + wide-temperature operation (-20°C to 60°C), dust- and vibration-resistant, stable long-term in non-air-conditioned industrial environments.

02

Multi-protocol Industrial I/O

Standard COM / CAN / GPIO / isolated I/O, connecting natively to PLCs, sensors and industrial buses without a third-party gateway.

03

Long-cycle Supply Commitment

3–5 years of same-model supply + 12-month advance EOL notice, meeting the long-term maintenance needs of industrial projects.

FOUR PRODUCT SERIES

Four Series — From General Control to Edge AI in One Stop

standard industrial PC series STANDARD
Standard Selection

Standard Industrial PC Series

Standard-spec design — order straight from the datasheet

View Details →
modular industrial PC series FlexCore MODULAR
FlexCore™

Modular Industrial PC Series

Modular architecture for flexible compute and I/O configuration

View Details →
AI computing IPC series AI EDGE
NVIDIA Jetson

AI Computing IPC Series

Industrial compute platform for edge computing and AI inference

View Details →
rackmount industrial PC series RACKMOUNT
1U / 2U / 4U

Rackmount Industrial PC Series

High-performance industrial computing platform for centralized deployment

View Details →
01
STANDARD FANLESS PC

Standard Industrial PC Series

Fanless compact chassis · 9-36V wide-voltage · industrial RS-232/485/422 · wide-temperature operation

standard fanless industrial PC EPC-10 Compact Series · EPC-30 Multi-COM Series

A standardized design spanning the Intel® Atom®, Celeron® and Core™ i3/i5/i7 platforms. With fanless cooling and a one-piece aluminum body, you can select and order straight from the datasheet — a proven, rock-solid solution for equipment control, machine vision, rail transit, smart warehousing and similar applications.

  • Fanless & compact: all-aluminum finned cooling, zero moving parts, IP40 dust protection
  • Wide voltage & temperature: 9-36V DC wide-voltage input, stable across -20 to +60℃
  • Complete industrial I/O: 4–6× COM, 4–8× USB 3.0, 2× GbE, isolated DIO
  • Flexible expansion: M.2 / Mini-PCIe / mSATA expansion slots

EPC-10 Compact Series · 229 × 160 × 47 mm

EPC-102AIntel® 12th Gen Core™ i3/i5/i7 EPC-109AIntel® 10th Gen Core™ i3/i5/i7 EPC-107AIntel® Celeron® J6412 low-power EPC-106AIntel® Celeron® J1900 economy

EPC-30 Multi-COM Series · 337 × 160 × 47.5 mm · 6× COM

EPC-302AIntel® 12th Gen Core™ i3/i5/i7 EPC-309AIntel® 10th Gen Core™ i3/i5/i7 EPC-307AIntel® Celeron® J6412 low-power EPC-306AIntel® Celeron® J1900 economy

Applications

Equipment control Machine vision Rail transit Smart warehousing Data acquisition
Get a Quote / Datasheet Download Datasheet
02
MODULAR · FLEXCORE™

Modular Industrial PC Series

FlexCore™ three-board architecture · i-Core + i-Function + i-Connect · any combination

FlexCore modular industrial PC FlexCore™ Modular Platform

Built on the FlexCore™ modular mainboard architecture, which fully decouples compute, expansion and I/O. Like building blocks, you can freely combine i-Core (compute), i-Function (expansion) and i-Connect (I/O) to match each project — a single model covers multiple configuration versions and cuts development time by more than 60%.

  • Swappable boards: i-Core / i-Function / i-Connect are independent and hot-upgradeable
  • Unified structure: unified interfaces, power supply and chassis airflow
  • Smart thermal control: adaptive airflow + multi-point temperature sensing with closed-loop control
  • Rich expansion: PCIe Gen4 / MXM / M.2 / i-Connect module slots

EPC Modular Sub-series · FlexCore™ three boards + smart thermal control

EPC-102BIntel® 12th Gen Core™ high-performance, multi-LAN EPC-102OIntel® Celeron® 7305 EDID customization EPC-202BIntel® 12th Gen Core™ multi-COM workhorse EPC-207BIntel® Celeron® J6412 multi-COM low-power EPC-302BIntel® 12th Gen Core™ high-performance, multi-LAN EPC-306PIntel® Celeron® J1900 Phoenix terminal multi-COM EPC-309EIntel® 10th Gen Core™ multi-LAN, multi-COM

UPC Universal Box Sub-series · universal chassis + multi-scenario customization (4G / redundant power / 14× USB / opto-isolated GPIO)

UPC-302DIntel® 12th Gen Core™ multi-COM UPC-302FIntel® 10th Gen Core™ · 14× USB UPC-309CIntel® 10th Gen Core™ · built-in 4G UPC-309RIntel® 10th Gen Core™ · redundant power UPC-209BIntel® 10th Gen Core™ · opto-isolated GPIO UPC-206FIntel® Celeron® J1900 · built-in 4G UPC-206EIntel® Celeron® J1900 economy UPC-108HIntel® 7th Gen Core™ economy option

Applications

AGV / AMR control AOI visual inspection Robot main controller Edge AI inference Medical imaging
Explore FlexCore™ Technology Inquire About Custom Configuration
03
NVIDIA JETSON · AI EDGE COMPUTING

AI Computing IPC Series

Engineered around NVIDIA® Jetson modules · empowering modern industry with AI+

EA-N500A edge AI computer - front main view - CESIPC EA-N500 157 TOPS
JETSON ORIN NX 16GB / 8GB

EA-N500 Series

A flagship edge AI computing platform built on the NVIDIA Jetson Orin™ NX module, with 4× PoE Gigabit ports plus rich industrial I/O — for industrial visual inspection, robot control and edge large-model inference.

  • CPU8-core Arm® Cortex®-A78AE @ 2.0 GHz
  • GPUNVIDIA Ampere 1024 CUDA® + 32 Tensor Core
  • AI computeup to 157 TOPS
  • I/O4× PoE Gigabit / USB 3.0 / HDMI / COM / CAN / GPIO
  • Power12-36V DC wide-voltage input
View Details Get a Quote / Datasheet
EA-N200A edge AI computer - front main view - CESIPC EA-N200 67 TOPS
JETSON ORIN NANO SUPER / 8GB / 4GB

EA-N200 Series

A mid-range industrial edge AI computer that flexibly hosts the Jetson Orin™ Nano in Super / 8GB / 4GB compute tiers, with 4× integrated PoE Gigabit — built for machine vision and real-time decision-making.

  • CPU6-core Arm® Cortex®-A78AE
  • GPUNVIDIA Ampere + Tensor Core
  • AI computeup to 67 TOPS
  • I/O4× PoE Gigabit / USB 3.0 / HDMI / COM / CAN / GPIO
  • Power12-36V DC wide-voltage input
View Details Get a Quote / Datasheet
EA-N100A edge AI computer - front main view - CESIPC EA-N100 472 GFLOPS
JETSON NANO 4GB

EA-N100 Series

An entry-level, compact industrial edge AI computer built on the Jetson Nano™ platform, balancing AI inference performance with low power — a cost-effective choice for deploying lightweight AI applications.

  • CPU4-core Arm® Cortex®-A57 MPCore @ 1.43 GHz
  • GPU128-core NVIDIA Maxwell™
  • AI compute472 GFLOPS
  • I/OHDMI / 2× USB / 1× LAN / GPIO
  • Power9-24V DC input
View Details Get a Quote / Datasheet

AI Series Applications

Industrial machine vision AGV / AMR autonomous navigation AOI defect detection Humanoid robot control Edge large-model inference Smart agriculture & farming
04
RACKMOUNT · 1U / 2U / 4U

Rackmount Industrial PC Series

Standard 19" rack form factor · Xeon® workstation platform · data centers / control rooms / test cabinets

rackmount industrial PC 1U 2U 4U EPC-R1U · R2U · R4U

Compliant with the EIA-310 standard 19" rack form factor in 1U/2U/4U heights, spanning everything from edge servers to industrial data centers. Built on a Xeon® multi-core, multi-channel memory platform with hot-swap power supplies and drives, RAID 0/1/5/10 and IPMI remote management for reliable 7×24 mission-critical operation.

  • Multi-platform support: Intel® Xeon® / Core™ i9, AMD EPYC™
  • Hot-swap redundancy: 1+1 redundant power, hot-swap drive backplane
  • Remote management: IPMI 2.0 / KVM over IP out-of-band management
  • High expandability: up to 8× full-length PCIe Gen4 slots

Representative Sub-series · 4U rackmount / wall-mount / Intel & Hygon domestic

IPC-610-I Series4U rackmount · 6th-9th Gen Core IPC-W10-I SeriesWall-mount · 6th-9th Gen Core IPC-W10-HG SeriesWall-mount · Hygon HG-3350 domestic

Applications

Domestic IT localization Server / control rooms Monitoring centers Industrial test cabinets Control-cabinet wall mounting Video stream analytics
Get a Quote / Datasheet Download Datasheet
STANDARDS & CERTIFICATIONS

Industry Standards & Certifications

ComputeOps™ rigorously follows international industrial, protection, safety and reliability standards — each one mapped to a hard requirement on the industrial floor.

CLASS A

EMC

Industrial-grade electromagnetic compatibility — compliant with EN 55032 / EN 61000 and other industrial EMC immunity requirements, running stably amid heavy interference from VFDs, motors and the like.

WIDE TEMP

-20℃ ~ 60℃

Industrial wide-temperature operation — deployable directly in outdoor cabinets, beside production lines and in non-air-conditioned rooms, with no extra climate control needed.

MTBF 60K+h

High-reliability MTBF

All-industrial-grade key components + rigorous burn-in testing, MTBF 60,000h+, for ≥ 6-8 years of failure-free operation on average.

LONG TERM

3-5 Year Same-model Supply

12-month advance EOL notice + compatible replacement plan — meeting the long-cycle maintenance needs of power grid, rail transit, CNC and similar projects.

ISO 9001

Quality Management System

Full ISO 9001:2015 quality management certification, covering design, production and after-sales across the entire process.

CE

EU CE Safety

Compliant with the EU Low Voltage Directive (LVD) and EMC Directive — compliant for projects exported to Europe.

FCC

US FCC EMC

Certified to FCC (Federal Communications Commission) electromagnetic compatibility — essential for export to the North American market.

CCC / RoHS

China Mandatory + Eco

China CCC compulsory certification + EU RoHS environmental restrictions — suitable for both domestic and overseas projects.

APPLICATION SCENARIOS

Typical Deployment Scenarios & Model Selection

Drawing on real project experience, recommended solutions for 4 high-frequency scenarios — challenges, solutions and recommended models at a glance.

smart manufacturing line control
Scenario 01

Smart Manufacturing Line Control

Challenge: fast line takt + coexisting multi-protocol equipment + real-time data upload to MES. Consumer PCs cannot withstand 24h continuous operation and shop-floor dust.

Solution: use a ComputeOps standard EPC (such as the EPC-102A series) + multiple COM ports + PoE LAN to interface with PLCs and MES, with industrial-grade EMC immunity.

Recommended models: EPC-102A · EPC-202A · EPC-10 Series

CNC machine tools / motion control
Scenario 02

CNC Machine Tools / Motion Control

Challenge: CNC systems require PCI / PCIe motion control cards + real-time control + long service life (machine-tool projects run 5-10 years) + industrial EMC immunity against VFD interference.

Solution: use ComputeOps modular / rackmount models (EPC-302A / IPC series) with PCI / PCIe card compatibility, an industrial-grade BIOS and long-cycle supply.

Recommended models: EPC-302A · IPC-W10-I Series · EPC-306A

unattended energy and power site
Scenario 03

Unattended Energy & Power Sites

Challenge: outdoor cabinet rooms + wide temperature + EMC immunity + remote O&M. Substations, pumped-storage plants and wind farms often have no air conditioning, demanding extremely high wide-temperature stability.

Solution: use a rugged EPC (IPC-W10-HG Hygon domestic / EPC-30 extended multi-COM) + IP65 protection + 4G/5G + watchdog self-recovery.

Recommended models: IPC-W10-HG Domestic · EPC-30 Series

edge AI visual inference
Scenario 04

Edge AI Visual Inference

Challenge: industrial vision compute + GPU cooling + real-time inference + multi-camera input. Machine vision, defect detection and smart sorting demand 50-200 TOPS of edge compute.

Solution: use a ComputeOps AI computing IPC (EA-N100A / EA-N200A / EA-N500A, built on NVIDIA Jetson Nano/Orin), with multiple PoE + USB 3.0 camera interfaces.

Recommended models: EA-N100A · EA-N200A · EA-N500A

FAQ

Frequently Asked Questions

Common questions about ComputeOps™, industrial computing selection and field deployment.

1. How is an industrial PC different from a regular PC?

Industrial PCs differ completely in component selection, thermal design, I/O configuration and supply cycle. Industrial-grade components withstand a wider temperature range and last longer; fanless cooling avoids dust-related failures; multiple COM/CAN/GPIO ports connect directly to PLCs; and 3-5 year supply of the same model matches project lifecycles. Consumer PCs are built for office environments and may be discontinued within 6-12 months, making them unsuitable for industrial projects.

2. How does a fanless industrial PC dissipate heat?

It relies mainly on whole-body heat dissipation through the aluminum chassis — the CPU transfers heat to the chassis via thermal grease or liquid metal, turning the entire surface into a heatsink. Combined with the i-Core board's temperature sensing and frequency-throttling strategy, it runs stably in -20℃ to 60℃ environments. The benefits are no fan noise, no dust failures and a long service life.

3. Box PC or rackmount industrial PC — how to choose?

A box PC (compact industrial PC) suits deployment beside line equipment, embedded in enclosures or in space-constrained settings, with DIN-rail or VESA wall mounting. A rackmount industrial PC (1U/2U/4U) suits centralized deployment in server rooms or control cabinets, with front I/O for easy maintenance. Choose rackmount for high-density large-scale deployment and box PCs for distributed field sites.

4. How long is the industrial supply commitment?

The CESIPC ComputeOps platform guarantees 3-5 years of supply for the same model. Customers with delivered projects receive a 12-month advance EOL notice plus a compatible replacement plan. This is critical for industrial projects — power grid, rail transit and CNC projects typically have 5-10 year maintenance cycles and cannot replace hardware frequently.

5. How should MTBF figures be interpreted?

MTBF (Mean Time Between Failures) = total operating time / number of failures. CESIPC ComputeOps products commonly reach 60,000h+. MTBF is not a warranty period but a statistical reliability indicator. Actual lifespan depends on field temperature, dust and vibration — a box PC with industrial-grade components and proper thermal design generally runs stably for 8-10 years.

6. How to choose between x86 / ARM / domestic platforms?

x86 (Intel / AMD) is mature and universal with the broadest software ecosystem; ARM (Jetson) suits edge AI and low power; domestic platforms (Phytium / Hygon / Rockchip) meet local-IT compliance requirements. ComputeOps supports them all — choose by software compatibility, compute needs and compliance.

7. For edge AI, choose Jetson or x86 + GPU card?

For compute needs under 50 TOPS (lightweight inference / edge gateway / first-pass industrial vision) → the Jetson Nano / Orin NX / AGX series, highly integrated, low power and compact. For demands over 100 TOPS (multi-model concurrency / training / HD stream analysis) → x86 plus a discrete GPU card (such as the NVIDIA RTX series). It depends on model complexity and inference real-time requirements.

8. Can it run reliably outdoors at -20℃?

Rugged ComputeOps models (such as the IPC-W10-HG / EPC-30 series) support a -20℃ to 60℃ wide temperature range + IP65 dust/water protection + vibration testing, suitable for outdoor cabinets, substations, vehicles and beside outdoor equipment. For extreme environments (-40℃ or 70℃+), a custom wide-temperature upgrade is required — please consult our sales engineers.

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