An Elkhart Lake modular embedded platform for low-power upgrade on the industrial floor
The EPC-207B series industrial PC uses a fanless embedded structure combined with CESIPC's proprietary patented FlexCore modular architecture, with DB-37 serial communication supporting 4× RS-485. It supports the onboard Intel® Celeron® J6412 processor, covering industrial application needs across every performance tier. The entire series is built to industrial-grade design standards and validated through rigorous testing — suited to mission-critical industrial scenarios in manufacturing, energy and transportation.
FlexCore™ four-element modularity (3 boards + smart thermal control) — upgrade compute, expand I/O and service features, all without replacing the whole unit.
i-Core compute + i-Function expansion (PoE / DIO / CAN / AI acceleration) + i-Connect I/O (multi-COM / LAN / comms, hot-swappable) + Smart Thermal control. Upgrade compute, expand I/O and service features — all without replacing the whole unit.
Intel® Celeron® J6412 4C4T, up to 2.6 GHz boost, just 10W TDP. A 10 nm process with low heat and high stability.
2× Intel Gigabit Ethernet for fast, stable industrial networking. Suited to multi-device coordination across PLCs, SCADA and vision systems.
4× USB 3.0 + 2× USB 2.0 + 2× RS-232 + 1× RS-485 + 2× GbE + HDMI + VGA + audio. High-density layout in a compact chassis.
The top i-Function I/O board can be swapped in the field, adding COM / CAN / digital I/O / Mini-PCIe and other expansions — upgrading without replacing the whole unit.
1× Mini-PCIe slot with optional dual-band Wi-Fi / Bluetooth / 4G / 5G modules, flexibly adapting to on-site networking.
A 3-pin pluggable Phoenix terminal with 9-36V DC wide-voltage input. Four-way protection against over-voltage, over-current, reverse polarity and surge — easy and secure wiring.
One-piece die-cast finned cooling in 6061 high-strength aluminum alloy with zero moving parts — maintenance-free, dust- and vibration-resistant, for industrial endurance.
Four protection mechanisms working together: ① power protection (over-voltage / over-current / reverse polarity / surge) + ② backup power (smart lithium-battery power-loss buffering) + ③ start/stop control (auto power-on when energized) + ④ system self-recovery (watchdog + fault restart).
6061 high-strength aluminum alloy + sheet-metal structure for an industrial-grade rugged body. The IP65 front panel resists dust and splashing water, with TPM 2.0 + watchdog for dual security.
Windows 10 / 11 · CentOS · Ubuntu 16.04 / 18.04 / 20.04 / 22.04. BIOS supports customization, boot logo and OEM branding.
Datasheet V1.0 · updated 2026-03-20 · due to chip market fluctuations, key chips may change; please confirm with sales.
| Item | Specification |
|---|---|
| Processor | Intel® Celeron® J6412 |
| Cores | 4 |
| Threads | 4 |
| Frequency | 2.0~2.6 GHz |
| Cache | 4 MB L3 Cache，1.5 MB L2 Cache |
| TDP | 10W |
| Graphics | Intel UHD Graphics 32EU |
| Memory | DDR4 8~32GB |
| Storage | 1× mSATA SSD |
| Item | Specification |
|---|---|
| USB 2.0 | 2 |
| USB 3.0 | 2 |
| RS232 | 4 |
| RS485 | 4 |
| VGA | 1 |
| HDMI | 1 |
| Gigabit Ethernet | 2 × LAN |
| Audio | 3.5mm TRRS |
| Wi-Fi (optional) | Dual-band 2.4G/5G Wi-Fi module |
| Item | Specification |
|---|---|
| Power Connector | 3-pin pluggable terminal block, 9–36V DC wide-range input |
| ATX Switch | 1× ATX power switch |
| Boot Mode | AT/ATX mode switch (built-in) |
| Item | Specification |
|---|---|
| Dimensions | 229 (L)×160 (W)×79 (H)mm |
| Mounting Dimensions | 219 (L)×100 (W)mm |
| Weight | 2 kg net weight |
| Enclosure Material | 6061 high-strength aluminum alloy |
| Mechanical Structure | Extruded aluminum + sheet-metal structure |
| Mounting | Bracket mounting / VESA wall mount |
| Reset Switch | 1× reset switch |
| TPM | TPM 2.0 |
| Watchdog | Hardware watchdog supported |
| MTBF | 60,000 hrs |
| Item | Specification |
|---|---|
| Operating Temperature | 0~60℃ (wide temp -40~80℃ optional) |
| Storage Temperature | -10~70℃ (wide temp -40~80℃ optional) |
| Relative Humidity | 10%~90%, non-condensing |
| EMC | CE, FCC (EN 55032 & EN 55035) |
| EMC Harmonics | EN IEC 61000-3-2 |
| Item | Specification |
|---|---|
| Windows | Windows 10 / Windows 11 |
| Linux | Ubuntu 16.04 / 18.04 / 20.04 / 22.04 |
| Item | Specification |
|---|---|
| Factory Certification | ISO9001: 2015 |
| BIOS Customization | BIOS / Boot LOGO / OEM |
The i-Function I/O board can be swapped in the field, adding features without replacing the whole unit — the core value of FlexCore™ modularity.
Unit 280 × 175 × 70 mm · mounting via bracket / VESA · net weight approx. 2.2 kg.
The standard configurations below can be ordered directly; for custom CPU / memory / storage / i-Function I/O boards, please contact sales.
| No. | Part Number | Model | Processor | Memory | Storage |
|---|---|---|---|---|---|
| 01 | C10.02.05.001 | EPC-207B | Intel® Celeron® J6412 | 8GB DDR4 | SSD 256GB |
Note: Due to market fluctuations, key components such as the CPU model, memory and storage may change — please consult our sales team for the current configuration.
Built on FlexCore™ modularity and rich I/O expansion, the EPC-207B is widely deployed across the 4 industrial scenarios below.
Tell us your project background, I/O and power requirements and volume — our engineers will respond within 24 hours with a full datasheet, quote and prototype evaluation plan.
