From November 15 to 16, 2025, the XIN Summit — a technology-innovation platform created by BEYOND Expo — will take place at Chuangzhi Yuncheng in Shenzhen's Nanshan District. The summit focuses on the AI hardware ecosystem, robotics, smart manufacturing, and next-generation compute, bringing together cutting-edge tech startups and the people driving their commercialization.
CESIPC will present its cloud-edge heterogeneous computing platform and cross-industry deployment solutions at booth C322 — we warmly invite you to stop by.
Exhibit Highlights
- EA-N series edge AI IPCs (the full Jetson Orin Nano / NX lineup)
- EA-W12 AI industrial touch panel PC (12.5" edge AI all-in-one)
- FieldOps™ L3 FIDCP portable integrated field command platform
- CleanOps™ S-Series stainless-steel built-in IP69K panel PC
Speaking Session · On-Site Agenda
Our engineers will deliver a speaking session during the summit: "From Hardware to Solutions — 17 Years of Cloud-Edge Practice in Industrial Computing." The talk will cover: how the FlexCore™ modular hardware accelerates AI adoption in industry; how EdgeSync™ edge coordination builds on-site resilience against network outages; and best practices for cloud-edge heterogeneous computing in real-world settings.
We warmly invite you to booth C322 to meet our technical experts in person and get hands-on with industrial-grade AI edge computing devices. To book a technical discussion slot ahead of the event, contact our sales team in advance.
