On November 15–16, 2025, BEYOND Expo's technology innovation platform — XIN Summit — will be held at Chuangzhi Cloud City in Shenzhen's Nanshan District. The summit focuses on the AI hardware ecosystem, robotics, smart manufacturing and new compute architectures, bringing together leading tech founders and the industry leaders driving commercialization.
CESIPC will showcase its device-edge heterogeneous computing platform and multi-industry deployment solutions at booth C322. We look forward to meeting you.
Booth Highlights
- EA-N Series edge AI industrial PCs (full Jetson Orin Nano / NX lineup)
- EA-W12 AI industrial touch panel PC (12.5" + edge AI all-in-one)
- FieldOps™ L3 FIDCP portable integrated field command platform
- CleanOps™ S Series stainless-steel built-in IP69K industrial panel PCs
Keynote & On-Site Agenda
Our engineers will deliver a keynote session: "From Hardware to Solutions — 17 Years of Device-Edge Orchestration in Industrial Computing". The talk will cover: (1) how FlexCore™ modular hardware accelerates AI deployment in industrial settings; (2) how EdgeSync™ edge orchestration delivers on-site resilience when networks fail; (3) best practices for device-edge heterogeneous computing in real-world scenarios.
Visit us at booth C322 for a face-to-face technical discussion and hands-on time with our industrial-grade edge AI computing devices. Follow the CESIPC WeChat channel before the show to reserve a dedicated on-site technical consultation slot.
