On October 17, 2025, CESIPC concluded a successful three-day run at ITAP 2025 (Industrial Transformation Asia-Pacific) in Singapore. As an innovator focused on industrial computing, CESIPC brought several new products to the show, demonstrating its latest breakthroughs in AI applications, edge computing, and smart manufacturing.
Show Highlights
- The EA-N500A flagship edge AI IPC (Jetson Orin NX 16 GB · 157 TOPS) was the most-visited exhibit on the floor
- The FieldOps™ L3 FIDCP portable integrated control platform drew in-depth talks with several emergency-response and unmanned-systems integrators
- The CleanOps™ G-Series full 316 stainless-steel IP69K panel PC caught the attention of Southeast Asian food and pharmaceutical manufacturers
- A live demo of the FlexCore™ modular board architecture highlighted the long-term supply value of upgradeable mainboards
Feedback from Southeast Asian Customers
Over the three days, the CESIPC booth welcomed more than 300 trade visitors and system integrators from Singapore, Malaysia, Indonesia, Thailand, Vietnam, the Philippines, and other Southeast Asian markets — 12 countries in all. Semiconductor fabs, food manufacturers, and energy dispatch centers showed especially strong interest in partnership.
"The FlexCore™ modular design is a real breakthrough," said an R&D director from a Singapore semiconductor fab after trying the EA-N500A. "We no longer have to redesign the whole system for every upgrade — the board can be swapped out on its own, which saves us 60% of our development time."
Our thanks to every customer and partner who stopped by. The show may be over, but the partnerships are just beginning — CESIPC will continue to grow in Southeast Asia, delivering highly reliable industrial computing solutions to more customers in smart manufacturing, industrial automation, and edge AI.
