On October 17, 2025, CESIPC wrapped up a successful three-day exhibition at ITAP 2025 (Industrial Transformation Asia-Pacific) in Singapore. As an innovator focused on industrial computing, CESIPC brought multiple new products to the show — demonstrating the company's latest breakthroughs in AI applications, edge computing and smart manufacturing.
Booth Highlights
- EA-N500A flagship edge AI industrial PC (Jetson Orin NX 16G · 157 TOPS) — the most-visited exhibit at the booth
- FieldOps™ L3 FIDCP portable integrated control platform — attracted in-depth conversations with emergency response and unmanned-system integrators
- CleanOps™ G Series full-body 316L stainless-steel IP69K industrial panel PC — strong interest from Southeast Asian food & pharmaceutical manufacturers
- FlexCore™ modular mainboard architecture live demonstration — underscoring the long-term supply value of an "upgradeable mainboard"
Southeast Asia Customer Feedback
Across the three days the CESIPC booth received more than 300 professional visitors and system integrators from 12 Southeast Asian countries including Singapore, Malaysia, Indonesia, Thailand, Vietnam and the Philippines. Semiconductor fabs, food & beverage manufacturers and energy dispatch centers showed especially strong interest in collaboration.
"FlexCore™ modular design is a breakthrough" — said an R&D director from a Singapore semiconductor fab after trialing the EA-N500A. "We don't need to redesign the whole system for every upgrade — the mainboard can be swapped independently. That alone could cut our R&D cycle by 60%."
Thank you to every customer and partner who visited the booth. The show is over but the partnerships are only just beginning — CESIPC will continue to invest in the Southeast Asia market, delivering highly reliable industrial computing solutions to more customers in smart manufacturing, industrial automation and AI edge intelligence.
