On March 1, 2026 (the 13th day of the Lunar New Year), Shenzhen Cloud Embedded Technology Co., Ltd. (CESIPC) officially returned to work, fully resuming operations across its industrial AI IPC and edge computing platform business.
We thank all our customers and partners for their patience during the holiday break. In the year ahead, CESIPC will continue to deepen its work in industrial computing and smart manufacturing, bringing the three core technologies refined over 17 years — the FlexCore™ modular hardware architecture, SafeCore™ industrial-grade reliability, and EdgeSync™ edge coordination — to even more real-world customer applications.
Priorities for the Year Ahead
- AI + Industry: expanding the EA series on the NVIDIA Jetson Orin platform, spanning entry-level to flagship compute
- Hygiene + Food: rolling out the CleanOps™ four-tier G/S/L/E protection system to food, pharmaceutical, and semiconductor customers
- Field Command: deploying the FieldOps™ L3 FIDCP platform into system-level scenarios such as emergency response, unmanned systems, and shipborne maritime use
- Customer Service: expanding our nationwide field-engineer network and further strengthening our 24-hour on-site response
Effective immediately: for all orders placed on or after March 1, 2026, our engineers will respond within 24 hours, while orders left pending before the holiday will ship throughout this week. For urgent needs, please contact our sales team at any time.
In the new year, we look forward to writing a new chapter together with our customers, moving forward steadily across industrial automation, AI edge computing, and smart manufacturing.
