Events & Exhibitions

CESIPC Returns to Malaysia with Its Modular “Building-Block” Industrial Computing Platform

A strong comeback to Southeast Asia after two years, with a modular design concept that electrified the floor

· CESIPC
CESIPC Returns to Malaysia with Its Modular Building-Block Industrial Computing Platform

After a two-year hiatus, CESIPC made a powerful return to Automation Expo Malaysia in May 2025, unveiling a new-generation design philosophy for industrial computers. Our latest innovation — a "building-block" modular design — became an instant focal point on the show floor and won broad praise from industry professionals.

What Is the "Building-Block" Modular Design?

Once a traditional IPC is finalized, any change — a new CPU generation, different I/O requirements, or an improved thermal solution — forces a full redesign of the system, with development cycles stretching 3–6 months. CESIPC's in-house FlexCore™ modular board architecture splits the IPC mainboard into three standardized modules:

  • i-Core board — the compute core (CPU + memory + storage + base I/O)
  • i-Function board — feature expansion (serial ports, DIO, CAN, RFID, and more, configured to order)
  • i-Connect board — interface orchestration (flexible combinations of multiple GbE / USB / HDMI ports)
  • The three boards mate through standardized connectors, so any combination within the same chassis size yields countless product configurations

Real Customer Benefits

60% shorter development cycles: a CPU upgrade only requires swapping the i-Core, while the chassis, power, and I/O stay the same · 70% lower validation costs: expansion boards are validated once and reused · 7–10 years of supply: after a customer freezes the platform, boards can be replaced as needed without affecting the chassis or software · 5× faster OEM adaptation: project-level customization only requires changing the i-Function board.

A representative from a Kuala Lumpur equipment OEM remarked at the booth: "This is the design philosophy we've waited ten years for. An IPC maker has finally turned 'modular' from a slogan into a product you can actually deploy."

During the show, the CESIPC booth hosted customers from Malaysia, Indonesia, Thailand, the Philippines, and other Southeast Asian countries. Several system integrators signed letters of intent on the spot, and over the next six months we will move multiple projects forward together. We welcome Southeast Asian customers to stay in touch — see you at the next regional show!

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